GROUNDED: EMC/EMI & PCB Design Nuggets

Misconceptions about electron flow cause EMC test failures.

Engineers often view signals as electrons moving through traces.

This overlooks the propagation of electromagnetic fields.

An ineffective stackup allows fields to radiate as EMI.

A well-designed stackup channels electromagnetic fields efficiently.

Signal layers adjacent to Return and Reference Planes (RRP) minimize field leakage.

A four-layer stackup with RRP reduces emissions significantly.

The stackup acts like riverbanks guiding energy flow.

Optimize your stackup for EMC compliance.

For more EMC tactical strategies read my latest article here:

https://fresuelectronics.com/post/mastering-electromagnetic-interference

-Dario

P.S. Master EMI with my EMI Control Guides Bundle. 30% off this week: