Optimizing PCB Stackup Design For EMI Control
I’ve just released my latest technical article which dives into a critical yet often overlooked aspect of PCB design.
In this in-depth analysis, I cover:
- The Standard 4-Layer PCB Stackup and Its Inherent Limitations
- Interplane Capacitance: Benefits and Key Considerations
- Challenges Introduced by Using Power Planes as References
- The Problem of Via Transitions
- A Recommended Stackup Design Approach
- When Power Planes Are Truly Necessary (and When They’re Not)
Whether you’re working on high-speed digital circuits, mixed-signal designs, or power electronics, these insights can help you create more reliable and electromagnetically compatible systems.
Click here to read the full article: https://www.fresuelectronics.com/post/optimizing-pcb-stackup-design-power-and-return-path-considerations
-Dario
P.S. This article is adapted from a lesson in our EMC/EMI Design Course.
If you’re interested in advancing your skills and master EMI Control, I invite you to explore the course content and check out our new EMI Control Guides series.